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SEMICON Japan
 
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Tokyo Big Sight
 
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Front-end Process and Parts Zone : 1)¹è¿­ µðÀÚÀÎ / ¹è¿­ µðÀÚÀÎ µµ±¸ 2)Mask / Reticle Á¦Á¶Àåºñ Æ÷Åä ¸®¼Ò±×·¡ÇÇ Àåºñ/¿¡Äª/ÁõÂø/½ÃÇè°Ë»çÀåºñ 3)Wafer Á¦Á¶Àåºñ Single Crystal Á¦Á¶Àåºñ/Wafer°¡°øÀåºñ/Å×½ºÆ®/°Ë»çÀåºñ
Fab½Ã¼³ / °ü·ÃÀåºñ / ¿î¼Û·Îº¿ / È­Çмöµµ / °¡½º / Á¶¸í°ú ·¹ÀÌÀú / Ŭ¸° ·ë ½Ã¼³ ¾ÈÀü / ±âŸ °ü·Ã Àåºñ ¹× Àç·á
Back-end Equipment and Parts Zone : 1)Á¶¸³, Æ÷Àå Àåºñ Dicer/ Bonder / ÆÐŰ¡ Àåºñ / Ç¥¸é ½ÇÀå ±â¼ú / ±âŸ °ü·Ã Àåºñ 2)½ÃÇè / °Ë»ç Àåºñ ·ÎÁ÷, ¸Þ¸ð¸®, ¼±Çü ¹× È¥ÇÕ ½ÅÈ£ Å×½ºÆ® Àåºñ / ±âŸ °ü·Ã Àåºñ
Back-end Facilities and Materials Zone : Fab½Ã¼³ / °ü·Ã Àåºñ 󸮱â / Leadframe / Molding contest pound / ¼Ö´õ
Front-end/Back-end Combined Zone : 1)¼³°è/Á¦ÀÛ Áö¿ø ¼ÒÇÁÆ®¿þ¾î / ½Ã¹Ä·¹ÀÌ¼Ç ¼ÒÇÁÆ®¿þ¾î / CAD ¼ÒÇÁÆ®¿þ¾î / EDA µµ±¸ ǰÁú Á¦¾î ½Ã½ºÅÛ µî 2)ÇÁ·±Æ® ¿£µå ¹× ¹é ¿£µå ÇÁ·Î¼¼½º Àåºñ, ºÎǰ, ½Ã¼³Àç·á
Feature Pavilion Area : 1)MEMS : MEMS Àåºñ, ÃøÁ¤, °Ë»ç µµ±¸, Àç·á, MEMS Devices, MEMS application 2)³ª³ë±â¼ú : ³ª³ë Àç·á, ³ª³ë µð¹ÙÀ̽º Àåºñ, ³ª³ëÃøÁ¤

 
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